Apparatus for polishing peripheral portion of wafer

Details Apparatus for polishing peripheral portion of wafer Apparatus for polishing peripheral portion of wafer

1995-12-05

1998-06-16

Eley, Timothy V.

Abrading

Machine

Reciprocating tool

451 43, B24B 500

Patent

active

057660654

ABSTRACT:
A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.

REFERENCES:
patent: 2209538 (1940-07-01), Rabe
patent: 3753321 (1973-08-01), David
patent: 4796387 (1989-01-01), Johnson
patent: 5144772 (1992-09-01), Kawamata et al.
patent: 5398460 (1995-03-01), Joncour
patent: 5476413 (1995-12-01), Hasegawa et al.
patent: 5509850 (1996-04-01), Morioka et al.

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