Apparatus for polishing notch portion of wafer

Details Apparatus for polishing notch portion of wafer Apparatus for polishing notch portion of wafer

1994-05-26

1995-10-17

Kisliuk, Bruce M.

Abrading

Machine

Rotary tool

451 44, B24B 700

Patent

active

054585295

ABSTRACT:
A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.

REFERENCES:
patent: 1220287 (1917-03-01), Styll et al.
patent: 4905425 (1990-03-01), Sekigawa et al.
patent: 5185965 (1993-02-01), Ozaki
patent: 5271185 (1993-12-01), Hosokawa
patent: 5289661 (1994-03-01), Jones et al.

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