Apparatus for polishing chamfers of a wafer

Details Apparatus for polishing chamfers of a wafer Apparatus for polishing chamfers of a wafer

1992-11-23

1994-06-07

Rose, Robert A.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51283E, B24B 906

Patent

active

053178360

ABSTRACT:
An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.

REFERENCES:
patent: 1268974 (1918-06-01), Hoppes
patent: 4344260 (1982-08-01), Ogiwara
patent: 5185959 (1993-02-01), Ikola et al.

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