Apparatus for polishing a substrate at radially varying polish r

Details Apparatus for polishing a substrate at radially varying polish r Apparatus for polishing a substrate at radially varying polish r

1997-07-17

1998-10-06

Rose, Robert A.

Abrading

Machine

Rotary tool

451 60, 451446, B24B 1922, B24B 5702

Patent

active

058169008

ABSTRACT:
A polishing apparatus and method is disclosed, whereby fluid is delivered at dissimilar flow rates and pressures across a wafer. The fluid is delivered either directly to the wafer or through a polishing pad. Changing the fluid delivery allows the removal properties of the fluid to polish material from the wafer surface based on the location of that material relative to the center of the wafer. The fluid delivery system and the polishing pad oscillate relative to a rotating wafer. The radius of oscillation is relatively small compared to the size of the wafer to allow removal along one or more concentric rings and/or circles across the wafer.

REFERENCES:
patent: 4490948 (1985-01-01), Hanstein et al.
patent: 5531635 (1996-07-01), Mogi
patent: 5554064 (1996-09-01), Breivogel et al.
patent: 5569062 (1996-10-01), Karlsrud
patent: 5643067 (1997-07-01), Katsuoka et al.
patent: 5658185 (1997-08-01), Morgan, III et al.
patent: 5679063 (1997-10-01), Kimura et al.

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