Apparatus for polishing a dielectric layer formed on a substrate

Abrading – Precision device or process - or with condition responsive... – Controlling temperature

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451285, B24B 4900

Patent

active

056649860

ABSTRACT:
An apparatus for polishing a dielectric layer deposited on a top surface of a semiconductor substrate includes a table, a semiconductor substrate, a carrier, a pipe, a nozzle and an actuator assembly provided with a base, a power source, a cavity and a thermally expanding material. The actuator assembly controls the vertical position of the table by supplying a current to the thermally expanding material.

REFERENCES:
patent: 3948089 (1976-04-01), Shaw et al.
patent: 4045654 (1977-08-01), Eide
patent: 5113622 (1992-05-01), Nishiguchi et al.
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5476414 (1995-12-01), Hirose et al.

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