Apparatus for polishing

Details Apparatus for polishing Apparatus for polishing

1992-06-25

1993-09-21

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156636, 156662, 51209R, 51317, B44C 122, H01L 21306, B24R 100

Patent

active

052465250

ABSTRACT:
An apparatus for polishing a substrate is composed of a polishing plate having a pad on the surface thereof, a substrate retainer to retain the substrate being faced with exposed surface of the pad, allowing the exposed surface of the substrate to contact the surface of the pad, a slurry supply means for supplying slurry for polishing the substrate toward the surface of the pad, and a controlling means for controlling the supply amount of the slurry on the desired position of the surface of the pad. The controlling means includes a plurality of slurry supply ports concentrically located on the pad through the polishing plate. The slurry supply ports may be sparsely arranged, or alternatively, the diameter of the slurry supply ports may be gradually enlarged, according to getting close the slurry supply ports located adjacent the circumference portion of the pad from that located adjacent the center portion thereof. The controlling means may be arranged to independently supply a desired amount of the slurry from the slurry supply means to the desired positions of the pad.

REFERENCES:
patent: 4021279 (1977-05-01), Hirs
patent: 4557785 (1985-12-01), Ohkuma
patent: 4940507 (1990-07-01), Harbarger

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