Apparatus for plating semiconductor wafers

Details Apparatus for plating semiconductor wafers Apparatus for plating semiconductor wafers

1980-12-10

1982-07-13

Gantz, Delbert E.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204275, 204297R, C25D 1706, C25D 1704

Patent

active

043393195

ABSTRACT:
An apparatus for applying a bump-plating on one surface of a semiconductor wafer, which comprises a plurality of cup-shaped plating basins and a plurality of holders, each of the holders being engageable with a relevant one of the basins to set a semiconductor wafer horizontally, in which the underside surface to be plated of the wafer is contacted with plating liquid vertically blown up, the top peripheral portion of each said basin is of a curved convex cross-sectional form to thereby permit the plating liquid to flow over said top peripheral portion of the basin in essentially laminar stream condition by surface tension of the plating liquid.

REFERENCES:
patent: 2475434 (1949-07-01), Moss
patent: 2502495 (1950-04-01), Waterman
patent: 2721839 (1955-10-01), Taylor
patent: 4126533 (1978-11-01), Lukyanchikov et al.

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