Apparatus for plating elongated bodies

Details Apparatus for plating elongated bodies Apparatus for plating elongated bodies

1974-12-05

1976-06-15

Edmundson, E. C.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204269, C25D 508, C25D 1700

Patent

active

039635694

ABSTRACT:
An electropolished, copper plated, beryllium copper wire is plated with a composite coating of a nickel-iron-cobalt alloy. Such coating consists of a layer having a high anisotropic field parameter, of the order of 6 oersteds or higher, adjacent the surface of the wire, superimposed by a layer having a lower anisotropic field parameter, of the order of 4 oersteds or less. The wire is plated in two plating cells, the first of which is provided with a plurality of passages directing the flow of a plating electrode with a major component of flow across the wire and a minor component of flow in one direction along the wire. The second plating cell is provided with a plurality of passages directing the flow of a plating electrolyte substantially transverse to the wire. The electrolyte supplied to the first cell contains salts of iron, nickel and cobalt, with cobalt being present in a relatively high concentration. A similar electrolyte is supplied to the second cell except that its maximum concentration of cobalt is about one fifth of that of the first electrolyte.

REFERENCES:
patent: 2370973 (1945-03-01), Lang
patent: 3592753 (1971-07-01), Semienko et al.
patent: 3650935 (1972-03-01), Andersson
patent: 3654114 (1972-04-01), Brandstaetter
patent: 3720595 (1973-03-01), Kohler

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