Apparatus for plating a layer onto a metal strip

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204DIG7, C25D 1700, C25D 1712

Patent

active

041837991

ABSTRACT:
An improvement in a device for plating a thin layer of a first metal onto the surface of a generally flat metal strip formed of a second metal as the strip is moving in a selected direction along a given path, wherein the device includes an anode in the chamber and means for supplying electrolyte containing ions of the first metal between the anode and the moving strip. The improvement involves providing the anode as an electrically conductive, non-consumable, anode element having an outer surface with a transverse width substantially as great as the width of the strip. A plenum chamber is formed behind the anode element and generally coextensive with the outer surface of the element so that apertures in the anode element direct jets of electrolyte through the anode element and directly against the surface being plated to provide a uniformly turbulent flow of electrolyte at the surface of the strip.

REFERENCES:
patent: Re23456 (1952-01-01), Rieger
patent: 2307928 (1943-01-01), Hogaboom
patent: 2382018 (1945-08-01), Martin
patent: 2509304 (1950-05-01), Klein
patent: 2569577 (1951-10-01), Reading
patent: 2690424 (1954-09-01), Hassell
patent: 2695269 (1954-11-01), De Witz et al.
patent: 2989445 (1961-06-01), Lloyd et al.
patent: 3038850 (1962-06-01), Wagner
patent: 3287238 (1966-11-01), Latawiec et al.
patent: 3354070 (1967-11-01), Carter
patent: 3468783 (1969-09-01), Avellone
patent: 3483113 (1969-12-01), Carter
patent: 3809642 (1974-05-01), Bond et al.
patent: 3975242 (1976-08-01), Matsuda et al.
patent: 4025413 (1977-05-01), Nightingale et al.
patent: 4030999 (1977-06-01), Allen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus for plating a layer onto a metal strip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for plating a layer onto a metal strip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for plating a layer onto a metal strip will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1027632

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.