Apparatus for plating

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204225, 204297W, C25D 1702, C25D 1708

Patent

active

042984467

ABSTRACT:
An apparatus optimum for partially plating such rectangular objects as an IC lead frame obtained by subjecting thin metal pieces to press working and etching. The apparatus is characterized in that a support carriage aligns and supports the plurality of objects to be plated in advance, positioning means align the objects as regards the plating tank the lead wire as a cathode is contacted at the same time with the upper side of each object to be plated and the whole of the plural number of objects to be plated is masked, thereby performing plating by jetting the plating liquid onto respective portions to be plated.

REFERENCES:
patent: 3391065 (1968-07-01), Gerhard
patent: 3763027 (1973-10-01), Pearson
patent: 3835017 (1974-09-01), Mentone et al.
patent: 4033844 (1977-07-01), Pantiga et al.
patent: 4126533 (1978-11-01), Lukyanchikov et al.
patent: 4163704 (1979-08-01), Murata

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