Apparatus for plasma deposition

Details Apparatus for plasma deposition Apparatus for plasma deposition

1993-01-13

1995-07-25

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

With treating means

118723FI, 118723DC, 118723ER, 118728, C23C 1650

Patent

active

054358493

ABSTRACT:
The substrate in a plasma jet deposition system is provided with structural attributes, such as apertures and/or grooves, that facilitate efficient deposition. Groups of substrates are arranged with respect to the plasma beam in a manner which also facilitates efficient deposition. In addition to increasing the portion of the plasma beam volume which contacts the substrate surface or surfaces, it is advantageous to provide for the efficient evacuation of spent fluids away from the substrate so that fresh plasma containing the operative species can easily and continuously contact the substrate surface.

REFERENCES:
patent: 3845739 (1974-11-01), Erhart et al.
patent: 4401054 (1983-08-01), Matsuo et al.
patent: 4471003 (1984-09-01), Cann
patent: 4487162 (1984-12-01), Cann
patent: 4505947 (1985-03-01), Yukanovic et al.
patent: 4507588 (1985-03-01), Asmussen et al.
patent: 4585668 (1986-04-01), Asmussen et al.
patent: 4630566 (1986-12-01), Asmussen et al.
patent: 4691662 (1987-09-01), Roppel et al.
patent: 4913090 (1990-04-01), Harada et al.
patent: 4987002 (1991-01-01), Sakamoto et al.
patent: 5063031 (1991-11-01), Sato
patent: 5068871 (1991-11-01), Uchida et al.
patent: 5094878 (1992-03-01), Yamamoto et al.
patent: 5104634 (1992-04-01), Cakote
patent: 5108779 (1992-04-01), Gasworth
patent: 5132105 (1992-07-01), Remo
patent: 5204145 (1993-04-01), Gasworth

Affiliated with

Also associated with

Rating

Apparatus for plasma deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for plasma deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for plasma deposition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-737363