Apparatus for plasma assisted evaporation of thin films and corr

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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118 501, 118718, 118723, 427 42, 427 87, 427 93, B05D 306

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active

045144370

ABSTRACT:
An improved method of and apparatus for depositing thin films, such as indium tin oxide, onto substrates, which deposition comprises one step in the fabrication of electronic, semiconductor and photovoltaic devices. The method includes the novel steps of combining the use of (1) an electron beam to vaporize a source of solid material, and (2) electromagnetic energy to provide an ionizable plasma from reactant gases. By passing the vaporized solid material through the plasma, it is activated prior to the deposition thereof onto the substrate. In this manner, the solid material and the reactant gases are excited to facilitate their interaction prior to the deposition of the newly formed compound onto the substrate.

REFERENCES:
patent: 4107350 (1978-08-01), Berg et al.
patent: 4226082 (1980-10-01), Nishida
patent: 4336277 (1982-06-01), Bunshah et al.
patent: 4361114 (1982-11-01), Gurev
patent: 4379943 (1983-04-01), Yans et al.
Paton et al., Thin Solid Films, vol. 54, (1978), pp. 1-8.

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