Apparatus for placing chip type circuit elements on a board

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

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Details

29738, 29739, 29740, 29757, 29759, 29832, 29834, 156299, 156560, 156561, 156569, 221 93, 221296, 414126, 414784, B32B 3100

Patent

active

044513240

ABSTRACT:
An apparatus for locating chip type circuit elements on a printed circuit board includes an accommodating assembly for temporarily storing said circuit elements supplied from hoppers, a movable shutter placed under the accommodating assembly, and which supports and rotates circuit elements within the accommodating assembly, and a template placed under the shutter to receive the circuit elements dropped from the accommodating assembly when the shutter is removed laterally from under the accommodating assembly.

REFERENCES:
patent: 3327375 (1967-06-01), Reijnhard et al.
patent: 3566464 (1971-03-01), Bakermans
patent: 3658618 (1972-04-01), Gramann
patent: 3775941 (1973-12-01), Bross
patent: 3963456 (1976-06-01), Tsuchiya et al.
patent: 4160893 (1979-07-01), Meyer et al.

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