Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Patent
1997-03-13
1998-11-24
Heinrich, Samuel M.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
228246, 118213, B23K 306, H01L 2160
Patent
active
058396411
ABSTRACT:
A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.
REFERENCES:
patent: 5118027 (1992-06-01), Braun et al.
patent: 5219117 (1993-06-01), Lin
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5704536 (1998-01-01), Chen et al.
Heinrich Samuel M.
Industrial Technology Research Institute
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