Apparatus for placing a semiconductor chip as a flipchip on...

Details Apparatus for placing a semiconductor chip as a flipchip on... Apparatus for placing a semiconductor chip as a flipchip on...

2006-04-04

2006-04-04

Trinh, Minh (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S739000, C029S740000, C029S744000, C029S834000, C414S737000

Reexamination Certificate

active

07020954

ABSTRACT:
An apparatus for placing a semiconductor chip as a flipchip on a substrate has a flip device for flipping the semiconductor chip. The flip device is formed as a parallelogram construction which consists of a support bracket, a first and a second swivel arm and a connecting arm. A chip gripper is arranged on the connecting arm. A drive system serves the back and forth movement of the parallelogram construction between a first limit position where the chip gripper accepts the semiconductor chip and a second limit position where the chip gripper places the semiconductor chip on the substrate.

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Pantograph, Pantoja de la Cruz, pp. 151-152.

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