Apparatus for performing chemical-mechanical polishing

Abrading – Tool support for flexible-member tool – Having magnetic or suction tool holding means

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451285, 451286, 451287, 451288, 451290, 451550, 451494, B24D 910

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active

06033293&

ABSTRACT:
An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.

REFERENCES:
patent: 5584746 (1996-12-01), Tanaka et al.
patent: 5704827 (1998-01-01), Nishi et al.
patent: 5853317 (1998-12-01), Yamamoto

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