Apparatus for peeling semiconductor substrate

Details Apparatus for peeling semiconductor substrate Apparatus for peeling semiconductor substrate

1992-02-24

1993-08-31

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

156350, 156584, 511315, 73768, 437225, B32B 3100

Patent

active

052405460

ABSTRACT:
There is disclosed an apparatus for peeling a semiconductor substrate includes an unit for fixing a reinforcing plate bonded to the semiconductor substrate, a mechanism for pushing the semiconductor substrate bonded to the reinforcing plate in a direction parallel to a bonding surface, a unit for monitoring a stress generated by the semiconductor substrate, and a controller for controlling a driving unit of the pushing mechanism of the semiconductor substrate in accordance with the monitored stress.

REFERENCES:
patent: 3634930 (1972-01-01), Cranston
patent: 4433835 (1984-02-01), Wheeler
patent: 4519168 (1985-05-01), Cesna
patent: 4893513 (1990-01-01), Schroeder et al.
patent: 5013392 (1991-05-01), Virgadamo
patent: 5170929 (1992-12-01), Long et al.

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