Apparatus for peeling protective sheet

Details Apparatus for peeling protective sheet Apparatus for peeling protective sheet

2005-03-29

2005-03-29

Niebling, John F. (Department: 2812)

Metal working

Barrier layer or semiconductor device making

Reexamination Certificate

active

06872229

ABSTRACT:
Chips C which have already been diced are attached to a ring frame F using an adhesive sheet, and a protective sheet S1is attached to a circuit pattern surface of the chips C. The chips C, along with a ring frame F, are held in place on a table27of a protective sheet peeling apparatus20. A supply portion for an adhesive tape T is disposed in the vicinity of a table24, and the supplied adhesive tape T is attached to the protective sheet S1. When the protective sheet S1is peeled from the circuit pattern surface, peeling starts from corner portions of the chips C or opposing corner positions by pulling the adhesive tape T.

REFERENCES:
patent: 4722130 (1988-02-01), Kimura et al.
patent: 5891298 (1999-04-01), Kuroda et al.
patent: 6083811 (2000-07-01), Riding et al.
patent: 6676491 (2004-01-01), Arai et al.
patent: 20030060021 (2003-03-01), Kurosawa et al.
patent: 11-16862 (1999-01-01), None

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