Apparatus for packing filler into through-holes or the like in a

Details Apparatus for packing filler into through-holes or the like in a Apparatus for packing filler into through-holes or the like in a

1991-03-22

1992-09-08

Hoag, Willard

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

118300, 118301, 118504, 425 97, 425447, B29C 4708, B29C 4710

Patent

active

051456915

ABSTRACT:
An apparatus for packing a filler of conductive material into through-holes in a printed circuit board comprises a packing nozzle, an mask and a covering plate. The packing nozzle delivers a filler of conductive material through a delivery opening, and a delivery valve is mounted at the delivery opening. A manipulator is provided on the upper part of the nozzle for manipulating the delivery valve, and a nozzle tip is attachable to and detachable from the delivery opening. The mask has packing holes disposed in positions corresponding to those of the through-holes in the printed circuit board, and the mask is mountable on the upper side of the printed circuit board. The covering plate has escape holes in positions corresponding to those of through-holes in the printed circuit board, and the covering plate is disposable on the lower side of the printed circuit board. A squeegee may be provided on the lower part of the nozzle. The apparatus make it possible to attain a uniform and stable packing of filler into the through-holes without being affected by the thickness of the printed circuit board, the size of the through-hole diameter, or the fluidity of the filler.

REFERENCES:
patent: 2981981 (1961-05-01), Luhn
patent: 3102053 (1963-08-01), Way et al.
patent: 3492381 (1970-01-01), Rhyne
patent: 4008300 (1977-02-01), Ponn
patent: 4323593 (1982-04-01), Tsunashima
patent: 4604799 (1986-08-01), Gurol
patent: 4728568 (1988-03-01), Sasada et al.

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