Apparatus for packaging semiconductor devices

Details Apparatus for packaging semiconductor devices Apparatus for packaging semiconductor devices

1988-06-16

1991-01-29

Briggs, William

Metal working

Plural diverse manufacturing apparatus including means for...

Separate tool stations for selective or successive operation...

29740, 981153, 437217, B23P 2300, F24F 700, H05K 1300, H01L 2158

Patent

active

049876732

ABSTRACT:
An apparatus for packaging semiconductor devices includes a die bonder, a wire bonder, and a molding unit wherein the die bonder, the wire bonder, and the molding unit are sequentially arranged for operation in an uninterrupted continuous sequence. To prevent semiconductor dies from being contaminated by the dust generated by the molding unit, the die bonder and wire bonder are covered by an air cleaner chamber including an air filter and air ventilator. Alternatively, the molding unit is covered by an air draft chamber including an air supply nozzle and an exhaust pipe which exhausts the dust generated by the molding unit.

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patent: 4683644 (1987-08-01), Tange et al.
patent: 4723480 (1988-02-01), Yagi et al.
patent: 4781511 (1988-11-01), Harada et al.
patent: 4880581 (1989-11-01), Dastoli et al.

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