Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
1999-02-16
2001-12-04
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S112000, C438S127000
Reexamination Certificate
active
06326240
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATION
This application claims the priority benefit of Taiwan application serial no. 87121967, filed Dec. 31, 1998, the full disclosure of which is incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus and a method for packaging a semiconductor device. More particularly, the present invention relates to an apparatus and an improved method for a glob top packaging process.
2. Description of the Related Art
A liquid encapsulant and dam materials are used in various packaging technologies in a dispensing process. The process is widely used in chip-on-board (COB), flip chip (FC), ball grid array (BGA), chip scale package (CSP) and multi-chip module (MCM).
The dispensing process has to apply dam materials on the edge of a desired encapsulation area and a low-viscosity encapsulant material is applied on the top of the chip. The dispensing process is sequential processes, in which first the dam materials and then the encapsulation material and applied on each chip, one by one, to complete the process.
The current dispensing process has a low throughput and voids. Because the current process is performed at atmospheric pressure, air is easily mixed into the encapsulation material, and, as a result, voids are easily formed in the packages. These voids are decrease the reliability of the packages. Additionally, because the technology is split into two steps, it is difficult to increase the throughput. Moreover, the dam material increases manufacturing costs.
SUMMARY OF THE INVENTION
Accordingly, the present invention provides an apparatus and a method for packaging a semiconductor device that increases the reliability and the throughput of packages, and decreases manufacturing costs.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides an apparatus for packaging a semiconductor device. The apparatus includes a closed printing chamber having a baseplate on the bottom of the closed printing chamber. A pressure controlling system is connected to the closed printing chamber. The baseplate includes a heating unit. A paste source tank is located in the closed printing chamber.
To achieve these and other advantages and in accordance with the purpose of the invention, as embodied and broadly described herein, the invention provides a method for packaging a semiconductor device. The method includes the following steps. A baseplate located on the bottom of a closed printing chamber is provided. A device and a stencil having a mesh are mounted on the baseplate. The device is located within the mesh. An amount of preheated paste is placed on the stencil. A pressure of the closed printing chamber is adjusted to a first pressure. A printing step is performed to fill the mesh with the paste and cover the device. The pressure of the closed printing chamber is adjusted to a second pressure to remove voids trapped in the plugs. The pressure of the closed printing chamber is adjusted to a third pressure. A scraping step is performed to remove the redundant paste.
In the invention, the encapsulation area is defined by a mesh so that there is no need for the dam material. The process is performed in one step. The throughput is increased and the manufacturing costs are decreased. Because the process is performed in a vacuum, the problem of voids is avoided and the packages are more reliable.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed.
REFERENCES:
patent: 5729437 (1998-03-01), Hashimoto
patent: 5776798 (1998-07-01), Quan et al.
patent: 5973263 (1999-10-01), Tuttle et al.
patent: 5989982 (1999-11-01), Yoshikazu
patent: 5990545 (1999-11-01), Schueller et al.
patent: 6087202 (2000-07-01), Exposito
patent: 6093584 (2000-07-01), Fjeistad
patent: 6228676 (2001-05-01), Glenn et al.
Huang Jiawei
J.C. Patents
Picardat Kevin M.
World Wiser Electronics Inc.
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