Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1990-04-26
1992-03-10
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
156382, B32B 3100, B32B 3124
Patent
active
050947095
ABSTRACT:
A method and apparatus are provided for disposing a polymer film on an irregularly-shaped substrate at relatively high temperatures. In particular, the method and apparatus of the present invention provide a system for the packaging of very large scale integrated circuit chips. The system of the present invention particularly solves problems associated with high temperature processing and problems associated with the highly irregular surfaces that result. Nonetheless, the resultant product is capable of being fashioned into circuit chip systems which are independently testable and which may be reconfigured after testing by removal of the polymer film itself.
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Eichelberger Charles W.
Welles II Kenneth B.
Wojnarowski Robert J.
Ball Michael W.
Davis Jr. James C.
General Electric Company
Johnstone Adrienne C.
Snyder Marvin
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