Apparatus for packaging a semiconductor device

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Patent

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Details

Other Related Categories

29721, 29743, 29833, 228105, B23P 1904, B23K 3704, H01L 2160

Type

Patent

Status

active

Patent number

052128806

Description

ABSTRACT:
This invention is directed to an apparatus for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate, and the light reflected by the bonding head and the substrate form interference patterns. Adjustment of the inclination of the bonding head against the substrate is performed by observation of the interference fringes caused by the interference between the light reflected by the bonding head and the light reflected by the substrate.

REFERENCES:
patent: 3735911 (1973-05-01), Ward
patent: 3923584 (1975-12-01), Hojo et al.
patent: 4671446 (1987-06-01), Sherman
patent: 4677473 (1987-06-01), Okamoto et al.
patent: 4896206 (1990-01-01), Denham
patent: 4899921 (1990-02-01), Bendat et al.
"Interference of Light Waves", p. 791 of Physics for Scientists and Engineers, Raymond Serway, CBS College Publishing, 1982.

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