Apparatus for optimally scanning a two-dimensional surface of on

Details Apparatus for optimally scanning a two-dimensional surface of on Apparatus for optimally scanning a two-dimensional surface of on

1993-03-24

1994-05-17

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156635, 156654, 156657, 156662, 156643, H01L 21306, B44C 122

Patent

active

053125100

ABSTRACT:
An apparatus for optimally scanning a surface of one or more semiconductor wafers undergoing a chemical etching process, comprising: (a) means for registering the semiconductor wafers to a wafer retention stage; and (b) means for controlling a spiral pattern movement of a spiral type scan of the surface of the semiconductor wafers by the chemical etching instrument probe, whereby the surface is figured to correspond to a desired thickness.

REFERENCES:
patent: 3993909 (1976-11-01), Drews et al.
patent: 4274004 (1981-06-01), Kanai
patent: 4505585 (1985-03-01), Yoshikawa et al.
patent: 4668366 (1987-03-01), Zarowin
patent: 5223080 (1993-06-01), Ohta et al.

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