Apparatus for optical inspection of wafers during polishing

Details Apparatus for optical inspection of wafers during polishing Apparatus for optical inspection of wafers during polishing

1995-06-29

2000-04-04

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 41, 451285, B24B 4900

Patent

active

060454334

ABSTRACT:
An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafer's top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location while maintaining the patterned surface completely under water. The optical system also includes a pull-down unit for pulling the measurement system slightly below the horizontal prior to the measurement and returns the measuring system to the horizontal afterwards.

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