Apparatus for non-conductively interconnecting integrated circui

Details Apparatus for non-conductively interconnecting integrated circui Apparatus for non-conductively interconnecting integrated circui

1994-06-24

1997-05-13

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361766, 361734, H05K 702, H05K 116

Patent

active

056298382

ABSTRACT:
A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/repairability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.

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