Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-01-11
2011-01-11
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S766000
Reexamination Certificate
active
07869221
ABSTRACT:
An apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/reparability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.
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Knight Thomas F.
Salzman David B.
Dinh Tuan T
Oracle America Inc.
Park Vaughan Fleming & Dowler LLP
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