Apparatus for multi-component PCB mounting

Details Apparatus for multi-component PCB mounting Apparatus for multi-component PCB mounting

1996-01-29

1997-11-04

Lam, Cathy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

361777, 361767, 361772, 361774, 361760, 361761, 361768, 174261, 174268, 174263, 2281791, 2281801, 22818021, 22818022, 428901, B32B 300, H05K 702, H05K 710, H01R 900

Patent

active

056837887

ABSTRACT:
A printed circuit board includes a multi-component mounting footprint for mounting one of several possible differently sized discrete component packages on the circuit board. The multi-component mounting footprint includes a first mounting pad which has two connection points for mounting a connector on one of two different sized components. The footprint also includes a second mounting pad which is symmetric to the first mounting pad. About the mounting pads are cut outs which prevent solder buildup when either one of two different sized components are mounted thereon.

REFERENCES:
patent: 3403438 (1968-10-01), Best et al.
patent: 4195195 (1980-03-01), de Miranda et al.
patent: 4883920 (1989-11-01), Tanebe et al.
patent: 5446623 (1995-08-01), Kanetake
patent: 5453582 (1995-09-01), Amano et al.

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