Apparatus for mounting semiconductor devices

Details Apparatus for mounting semiconductor devices Apparatus for mounting semiconductor devices

1973-01-29

1976-01-13

Husar, Francis S.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

29589, 29626, 29628, H01L 2158

Patent

active

039319229

ABSTRACT:
Semiconductor devices are mounted on corresponding lead frames by being inserted into apertures of a masking member in a desired registration with the lead frame strip.

REFERENCES:
patent: 3102331 (1963-09-01), DaCasta
patent: 3517438 (1970-06-01), Johnson et al.
patent: 3541675 (1970-11-01), Pennings
patent: 3698618 (1972-10-01), Helda
patent: 3811187 (1974-05-01), Diel et al.

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