Apparatus for mounting semiconductor chips

Details Apparatus for mounting semiconductor chips Apparatus for mounting semiconductor chips

2007-10-30

2007-10-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S740000, C029S744000, C029S783000, C029S786000, C228S180220

Reexamination Certificate

active

10985424

ABSTRACT:
An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving table with a support surface on which the substrates are presented one after the other for transport by the transport device as well as a pusher device with a drive system and a slide for alignment of the substrate on an end stop. In accordance with the invention, the drive system and the slide comprise a first magnet and a second magnet that attract each other, ie, they are magnetically coupled. The drive system is arranged underneath the support surface and moves its magnet back and forth whereby the magnet of the slide is moved with it. One of the two magnets can also be a ferromagnetic body. The drive system is controlled by software.

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