Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate
2007-10-23
2007-10-23
Chang, Richard (Department: 3726)
Metal working
Means to assemble or disassemble
Means to assemble electrical device
C029S739000, C029S741000, C029S832000, C029S840000, C901S040000, C294S064200, C414S737000, C414S751100, C414S752100
Reexamination Certificate
active
10313183
ABSTRACT:
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1prevailing in the first pressure chamber and the pressure p2prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper. In the second operating mode, the pressure p1and/or the pressure p2and/or the pressure differential p1-p2is controlled.
REFERENCES:
patent: 4628576 (1986-12-01), Giachino et al.
patent: 4632018 (1986-12-01), Lymburner
patent: 5308132 (1994-05-01), Kirby et al.
patent: 5351872 (1994-10-01), Kobayashi
patent: 5741114 (1998-04-01), Onodera
patent: 6185815 (2001-02-01), Schindler
patent: 6328362 (2001-12-01), Isogai et al.
patent: 0 923 111 (1998-11-01), None
patent: 1 143 489 (2001-03-01), None
patent: 64-41230 (1987-08-01), None
patent: 08330790 (1995-05-01), None
patent: 10209687 (1997-01-01), None
patent: 10340931 (1997-06-01), None
patent: 11260840 (1999-01-01), None
European Search Report.
Chang Richard
ESEC Trading SA
Thelen Reid Brown Raysman & Steiner LLP
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