Apparatus for mounting semiconductor chips

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S739000, C029S741000, C029S832000, C029S840000, C901S040000, C294S064200, C414S737000, C414S751100, C414S752100

Reexamination Certificate

active

10313183

ABSTRACT:
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p1prevailing in the first pressure chamber and the pressure p2prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper. In the second operating mode, the pressure p1and/or the pressure p2and/or the pressure differential p1-p2is controlled.

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