Apparatus for mounting semiconductor chips

Details Apparatus for mounting semiconductor chips Apparatus for mounting semiconductor chips

2005-01-11

2005-01-11

Chang, Richard (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

73, 73, 73, 73

Reexamination Certificate

active

06839958

ABSTRACT:
An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.

REFERENCES:
patent: 4615093 (1986-10-01), Tews et al.
patent: 4653664 (1987-03-01), Hineno et al.
patent: 4810154 (1989-03-01), Klemmer et al.
patent: 4819326 (1989-04-01), Stannek
patent: 4915770 (1990-04-01), Haeda et al.
patent: 4937511 (1990-06-01), Herndon et al.
patent: 4943342 (1990-07-01), Golemon
patent: 5084959 (1992-02-01), Ando et al.
patent: 5131139 (1992-07-01), Oyama et al.
patent: 5157734 (1992-10-01), Chen et al.
patent: 5324087 (1994-06-01), Shimose et al.
patent: 0 236 225 (1987-09-01), None
patent: 0 907 311 (1999-04-01), None

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