Apparatus for mounting electronic components

Details Apparatus for mounting electronic components Apparatus for mounting electronic components

1981-06-24

1983-05-03

Hall, Carl E.

Metal working

Means to assemble or disassemble

Means to assemble electrical device

29743, 29759, 29834, 118243, 118503, 156299, 156303, 156552, 414226, 414753, B23P 1904

Patent

active

043816010

ABSTRACT:
Disclosed is a method for mounting electronic components comprising steps of sucking an electronic component such as semiconductor pellet to the tip end of an attraction nozzle, holding and automatically orienting the sucked electronic component by means of a plurality of arms arranged along the outer periphery of the tip end of the sucking nozzle, transferring the held electronic component to a predetermined bonding portion of a semiconductor device substrate such as stem, and opening the arms to bring down the electronic component onto the predetermined bonding portion for bonding. Also disclosed is an apparatus for executing this method.

REFERENCES:
patent: 2782756 (1957-02-01), Hunt
patent: 3010427 (1961-11-01), Hautau
patent: 3651957 (1972-03-01), Ball et al.
patent: 3918144 (1975-11-01), Mimata et al.
patent: 4135630 (1979-01-01), Snyder et al.

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