Apparatus for mounting electronic components

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29759, 29740, 29705, 29840, 29832, H05K 330

Patent

active

060948086

ABSTRACT:
An electronic component mounting apparatus for sucking up an electronic component and placing it onto a board with a suction nozzle, includes a step of switching over air pressure switching timings for the suction nozzle when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. The air pressure switching timings are switched according to a velocity of up and down movement of the suction nozzle and independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board. An electronic component mounting apparatus includes a suction nozzle for sucking an electronic component and placing it onto a board, a device for moving up and down the suction nozzle for suction and mounting of the electronic component, an air pressure switching unit for switching air pressure to the suction nozzle at an electronic component suction position and an electronic component mounting position, and a switching drive unit for performing switching control of the air pressure switching unit independently for each of when the component is sucked with the suction nozzle and when the sucked component is mounted on the board.

REFERENCES:
patent: 5307550 (1994-05-01), Izume et al.
patent: 5498942 (1996-03-01), Ijuin

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