Apparatus for mounting devices on a substrate

Metal working – Means to assemble or disassemble – Means to assemble electrical device

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Details

29759, 29704, 295646, 29741, 83 621, B23P 2100, B23P 2300

Patent

active

042363012

ABSTRACT:
The invention relates to a method and apparatus which is intended to equip a support substrate with integrated circuit devices of different kinds mounted originally on films. The apparatus includes a machine having cutting heads each associated with the film, and soldering heads. The substrate is mounted on a plate which is movable on a table in a direction perpendicular to the movement of the table, which movement takes place on a threaded spindle drive by a motor. The operation of the machine is monitored and controlled by a unit such as a computer. The invention is applicable in particular to mounting such devices on substrates intended for data-processing assemblies.

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