Apparatus for mounting components

Details Apparatus for mounting components Apparatus for mounting components

1992-10-09

1994-02-15

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228 62, 228102, H01L 21603

Patent

active

052859460

ABSTRACT:
An apparatus for mounting electronic components on the surface of printed boards by a suction head assembly 4 coupled to a head lift mechanism comprises a force sensor 6 for measuring the pressure exerted on the component by a mounting operation, and a microcomputer 1 for preparing a control signal in accordance with the deviation of the value measured by the force sensor from a desired value of pressure on the component. The rotation of a head lifting motor 51 is controlled based on the control signal.

REFERENCES:
patent: 4605833 (1986-08-01), Lindberg
patent: 4631685 (1986-12-01), Peter
patent: 4993618 (1991-02-01), Toyozawa et al.
patent: 5065933 (1991-11-01), Basavanhally
patent: 5113581 (1992-05-01), Hidese

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