Apparatus for mounting chips

Chemistry: electrical and wave energy – Apparatus – Electrophoretic or electro-osmotic apparatus

Reexamination Certificate

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Details

C029S729000, C029S739000, C029S740000, C029S744000, C204S275100, C204S643000, C204S660000, C204S664000, C205S089000

Reexamination Certificate

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06919007

ABSTRACT:
Disclosed is a method of mounting chips, including the steps of: dipping a mounting board in a solvent in which chips are dispersed; and mounting the chips on the mounting board by forming electric field gradients on the mounting board in correspondence with positions where the chips are to be mounted. With this configuration, fine chips such as fine semiconductor chips can be mounted at desired positions on a mounting board with a high efficiency and a high yield.

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patent: 5355577 (1994-10-01), Cohn
patent: 5525291 (1996-06-01), St. Julien
patent: 5824186 (1998-10-01), Smith et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 6274022 (2001-08-01), Asai et al.
patent: 6579745 (2003-06-01), Sanaka et al.
patent: 6687987 (2004-02-01), Mayer et al.
patent: 6780696 (2004-08-01), Schatz
patent: HEI 9-120943 (1997-05-01), None
patent: HEI 9-506742 (1997-06-01), None

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