Apparatus for mounting chip type circuit elements on printed cir

Details Apparatus for mounting chip type circuit elements on printed cir Apparatus for mounting chip type circuit elements on printed cir

1981-05-21

1983-02-08

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

29729, 29738, 29740, 29743, 29759, 29799, 156539, 156556, 156566, 156567, 156584, 221210, 221211, 414103, 414104, 414110, 414223, 414226, 414750, 414752, B32B 3104

Patent

active

043728022

ABSTRACT:
Apparatus for mounting chip type circuit elements on a printed circuit board include a supply unit for supplying chip type circuit elements, a plurality of pallets adapted to be connected intermittently in a longitudinal direction, a sequence head adapted to shift the circuit elements onto the pallets, an X-Y table adapted to receive and support a printed circuit board, a mounting mechanism having mounting heads adapted to mount the chip type circuit elements on the printed circuit board carried by the X-Y table, and a shifting head for shifting the chip type circuit elements from the pallets to the mounting head of the mounting mechanism. The mounting mechanism constitutes a rotatably indexing disc on which a plurality of mounting heads are radially situated, the sequence heads, shifting head and mounting heads each utilizing suction pins to which the chip type circuit elements are fixed during their movement from the supply unit to the printed circuit board.

REFERENCES:
patent: 3453714 (1969-07-01), Clark et al.
patent: 3475805 (1969-11-01), Rottman
patent: 4127432 (1978-11-01), Kuwano et al.
patent: 4135630 (1979-01-01), Synder et a.
patent: 4189137 (1980-02-01), Denney et al.
patent: 4292116 (1981-09-01), Takahashi et al.

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