Apparatus for mounting chip type circuit elements on a printed c

Details Apparatus for mounting chip type circuit elements on a printed c Apparatus for mounting chip type circuit elements on a printed c

1979-04-10

1981-09-29

Hess, Bruce H.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

29740, 29743, 29757, 29809, 156285, 156297, 156564, 156572, 221 93, 221 94, 221211, 414 60, 414121, B65G 5904, B65H 344, H01L 2198

Patent

active

042921163

ABSTRACT:
A method whereby chip type circuit elements are mounted at predetermined locations on a printed circuit board by a suction means and apparatus for performing the method are disclosed. The suction means picks up each circuit element from a respective stack supported in a vertical magazine and transfers and positions them above the predetermined locations on the printed circuit board which can have a predetermined pattern of laminar conductors on the upper surface thereof. The circuit elements are then released by termination of the applied suction and adhered to the board by a thermoplastic adhesive setting operation.

REFERENCES:
patent: 3009560 (1961-11-01), Frazier
patent: 3155272 (1964-11-01), Kelley
patent: 3479716 (1969-11-01), Zanger et al.
patent: 3757995 (1973-09-01), Armstrong
patent: 3992245 (1976-11-01), Franklin
patent: 4127432 (1978-11-01), Kuwano et al.

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