Apparatus for mounting chip device on printed circuit board

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With work feeding or handling means

Patent

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Details

156566, 156539, 29743, 1986891, 414567, 414761, B32B 100, B31F 500, B23P 1900, B65G 1746

Patent

active

049080920

ABSTRACT:
An apparatus for automatically mounting chip devices provided in tape units onto a printed circuit board at given positions thereof, the printed circuit board being placed on an XY table so that it is movable horizontally in X and Y directions. The apparatus includes a plurality of tape unit mounting units, each supplying chip devices one by one in the upside down fashion, a suction chamber arranged along the tape unit mounting units, a number of carriers each secured to an endless chain and having suction holes such that the suction holes of carriers are always communicated with the inside of the suction chamber, so that a chip device held and sucked on a carrier is fed along the suction chamber into a first transporting position, a turnover device for receiving the chip device at the first transporting position, holding the chip device with the aid of the suction force, turning over the chip device and feeding the chip device into a second transporting position, a mounting head having a suction nozzle receiving and holding the chip device with the aid of the suction force at the second transporting position and mounting the chip device on the printed circuit board.

REFERENCES:
patent: 2952457 (1960-09-01), Flieguer
patent: 3094128 (1963-06-01), Dearsley
patent: 4018342 (1977-04-01), Cuniberti et al.
patent: 4136767 (1979-01-01), Sarovich
patent: 4143776 (1979-03-01), Meyers et al.
patent: 4199288 (1980-04-01), Ganz
patent: 4372802 (1983-02-01), Harigane et al.
patent: 4393579 (1983-07-01), Van Hooreweder
patent: 4437232 (1984-03-01), Araki et al.
patent: 4529353 (1985-07-01), Dean et al.
patent: 4556362 (1985-12-01), Bahnck et al.
patent: 4752180 (1988-06-01), Yoshikawa

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