Apparatus for mounting and/or soldering or cementing electronic

Details Apparatus for mounting and/or soldering or cementing electronic Apparatus for mounting and/or soldering or cementing electronic

1989-04-18

1990-06-19

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 491, 221 95, 221154, 221211, B23K 3700

Patent

active

049345788

ABSTRACT:
In an apparatus for mounting and/or soldering or cementing electronic components, in particular SMD components, on printed circuit boards, haing a first carrier for at least one circuit board and a second carrier for the component, the first and second carriers being displaceable relative to one another parallel to the plane of the circuit board and transverse thereto, and having a magazine for the components which has chambers to receive the components, mixing up of the components can be largely avoided while ensuring that it is simple to remove the components from the magazine by providing the chambers with a lid that can be opened and closed by means of a fastening mechanism and having the fastening mechanism opened by the second carrier.

REFERENCES:
patent: 3893232 (1975-07-01), Fletcher et al.
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4617728 (1986-10-01), Andersen et al.
IBM Technical Disclosure Bulletin, "Auto Chip Transfer Tool", vol. 28, No. 7, pp. 2811,2812, Dec. 1985.

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