Apparatus for mounting and/or soldering or cementing electronic

Details Apparatus for mounting and/or soldering or cementing electronic Apparatus for mounting and/or soldering or cementing electronic

1989-04-18

1990-08-14

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 491, B23K 37047

Patent

active

049480260

ABSTRACT:
An apparatus for mounting and/or soldering or cementing electronic components on printed circuit boards, having a first carrier for at least one circuit board and a second carrier for the component, the first and second carriers being displaceable relative to one another parallel to the plane of the circuit board and transverse thereto, and having a magazine for the components, is constructed so that before or after the component has been placed on the printed circuit board displacements of the component or its carrier in at least one of its coordinate directions (X, Y, Z) transverse to and/or along the printed circuit board can be avoided. To achieve this a respective brake is associated with the carrier displaceable parallel to the plane of the circuit board in two directions of displacement transverse to one another that is effective for movement in one of the two displacement directions (X, Y) or in both displacement directions (X,Y) and which can be operated as desired or is operated when there is contact between the displaceable carrier, the component and the circuit board, and/or when there is physical contact between the component and the circuit board, and/or a brake is associated with the carrier displaceable transverse to the plane of the circuit board to stop it in a position in which there is physical contact between the displaceable carrier, the component and the circuit board.

REFERENCES:
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4696096 (1987-09-01), Green et al.

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