Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1997-08-13
2000-02-22
Jones, Deborah
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
156 64, 156382, G05G 1500
Patent
active
060268816
ABSTRACT:
An apparatus for monitoring parts bonded by a bonder such as an RF bonder having tunable electrodes for delivering respective variable amounts of RF energy to respective portions of the bonded part includes a plurality of thermometers, at least one thermometer for each electrode, for measuring respective surface temperatures of the bonded part. The apparatus also includes an electronic digital computer that records and displays effects of tuning the electrodes and circuitry for interfacing the computer to the thermometers. The computer receives and processes temperature measurements generated by the thermometers and information on a dwell time of the bonded part in a nest with no power, the electrodes' temperatures, an ambient temperature, and a geometry of the bonded part, and the computer uses this information to determine the effects of tuning the electrodes.
REFERENCES:
patent: 3573658 (1971-04-01), Hair et al.
patent: 3888715 (1975-06-01), Fraser et al.
patent: 4352707 (1982-10-01), Wengler et al.
patent: 4389438 (1983-06-01), Ohtsuki et al.
patent: 4713523 (1987-12-01), MacDonald
patent: 4941936 (1990-07-01), Wilkinson et al.
patent: 4941937 (1990-07-01), Iseler et al.
patent: 5064494 (1991-11-01), Duck et al.
patent: 5223684 (1993-06-01), Li et al.
patent: 5277737 (1994-01-01), Li et al.
patent: 5554252 (1996-09-01), Foran
"Instrumentation Reference and Catalogue, Test and Measurement Industrial Automation 1996", pp. 2-1-246; 3-154-3-172; 3-224-3228; 6-9-6-10, National Instruments Corp. 1995.
Jones Deborah
Koehler Robert R.
Lord Corporation
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