Apparatus for melting a solder by vapor-phase treatment

Details Apparatus for melting a solder by vapor-phase treatment Apparatus for melting a solder by vapor-phase treatment

1987-03-09

1988-07-26

Yuen, Henry C.

Heating

Having condition responsive control

Of protective work shield, cooler or atmosphere; or of heat...

432 59, 432179, 432197, 432210, 432 32, 34 78, 219271, 219275, F27D 1900, F26B 1900

Patent

active

047597100

ABSTRACT:
Apparatus for melting by vapor-phase treatment a solder applied to an object. The liquid serving for vapor production, which is situated in a vessel, is heated by electrical heating means which are disposed exclusively outside of the vessel and are completely enveloped by a liquid heat-carrying medium. The vessel floor is provided with projections to increase the thermal transfer. A tubing coil is furthermore disposed in the heat-carrying medium for rapid cooling thereof.

REFERENCES:
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patent: 2958520 (1960-11-01), Fritz
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patent: 4612712 (1986-09-01), Pescatore et al.
patent: 4628616 (1986-12-01), Shiari et al.
patent: 4629420 (1986-12-01), Waldron
patent: 4634000 (1987-01-01), Plapp et al.
patent: 4658513 (1987-04-01), Strattman

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