Apparatus for measuring, thinning and flattening silicon structu

Details Apparatus for measuring, thinning and flattening silicon structu Apparatus for measuring, thinning and flattening silicon structu

1994-09-13

1996-10-08

Rosenberger, Richard A.

Optics: measuring and testing

By polarized light examination

With light attenuation

G01B 1130

Patent

active

055637094

ABSTRACT:
A system is provided for processing wafers, such as silicon and silicon-on-insulator wafers. The processing includes thinning and flattening of the wafers at a work station located directly beneath a down looking metrology apparatus for directing light onto the wafer and measuring the light wavefronts reflected from the wafer. The metrology apparatus for flattening includes the feature of a multiple lens array for arranging the reflected wavefronts into a plurality of light spots, and a charge-coupled-device light responsive device for receiving the light spots and determining the shape of the wavefronts. The system also provides a wafer transport system for moving one or more wafers into one or more work stations beneath the metrology apparatus in a vacuum chamber.

REFERENCES:
patent: 4479848 (1984-10-01), Otsubo et al.
patent: 5094536 (1992-03-01), MacDonald et al.
patent: 5333049 (1994-07-01), Ledger
patent: 5393370 (1995-02-01), Ohta et al.
patent: 5450205 (1995-09-01), Sawin et al.

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