Apparatus for measuring bonding parameters

Details Apparatus for measuring bonding parameters Apparatus for measuring bonding parameters

1988-01-27

1989-02-21

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With testing, measuring, and/or indicating means

73582, 73588, 228104, 228110, B29C 6508

Patent

active

048061930

ABSTRACT:
In order to guarantee a constant quality of assembled modules, bonders in accordance with the object underlying the present invention must be monitored and potentially adjusted in suitable time intervals with respect to bonding force, ultrasound amplitude and bonding time. Further, it is an advantage that the present invention has a flexible format. In accordance with the invention, the registration of the measured values ensues with a mobile, piezo-electric sensor on a table of the bonder which is no higher than integrated circuits normally processed thereon. Fields of utilization cover all ultrasound bonders for integrated circuits.

REFERENCES:
patent: 3827619 (1974-08-01), Cusick et al.
patent: 3857279 (1974-12-01), Salzer et al.
patent: 4004456 (1977-01-01), Vahaviolos
patent: 4040885 (1977-08-01), Hight et al.
patent: 4373653 (1983-02-01), Salzer et al.
patent: 4696708 (1987-09-01), Keller et al.

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