Apparatus for material deposition for circuit board manufacture

Details Apparatus for material deposition for circuit board manufacture Apparatus for material deposition for circuit board manufacture

1994-08-29

1996-06-04

Collins, Laura

Coating apparatus

Solid member or material acting on coating after application

Reciprocating member

118213, 118242, 118254, 118406, 118413, 101123, B05C 700

Patent

active

055229298

ABSTRACT:
This invention improves a machine that has a squeegee-like blade that wipes across an apertured mask to apply to a printed circuit board solder paste or other conductive mounting material. The apparatus and method of the invention involve reciprocating the blade back and forth transverse to the direction of blade sweep across the mask, during the material-applying sweep of the blade across the mask. The reciprocating movement of the blade, combined with the sweep movement, deposits material onto the printed circuit board with high fidelity and with minimal voids.

REFERENCES:
patent: 4009047 (1977-02-01), Lindsay
patent: 4781114 (1988-11-01), Ericsson
patent: 4919970 (1990-04-01), Hoebener et al.
patent: 5044306 (1991-09-01), Erdmann
patent: 5050496 (1991-09-01), Klemm
patent: 5254362 (1993-10-01), Shaffer et al.
patent: 5332439 (1994-07-01), Watanabe et al.
patent: 5388508 (1995-02-01), Dubuit
Global Manufacturing, Inc. (1992) "Innovations in Technology".

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