Apparatus for manufacturing thin wafers of hard, non-metallic ma

Details Apparatus for manufacturing thin wafers of hard, non-metallic ma Apparatus for manufacturing thin wafers of hard, non-metallic ma

1988-05-09

1990-01-30

Rosenbaum, Mark

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51 73R, 51118, 51283R, 125 13R, B24B 700

Patent

active

048964590

ABSTRACT:
Method and apparatus for manufacturing thin wafers of hard, non-metallic material, such as monocrystalline or polycrystalline material for use as semiconductor substrates from bars of such material include an arrangement wherein prior to the completion of a slicing step wherein a disc-shaped workpiece or wafer is sliced from the bar, an end face of the bar is planed to a precisely planar condition whereupon the bar is sliced to separate a disc-shaped workpiece or wafer therefrom having a planar reference surface constituted by the planed end face of the bar. The apparatus can include an internal hole saw for slicing the bar and a grinding device for planing the end face thereof.

REFERENCES:
patent: 2382257 (1945-08-01), Ramsay
patent: 3154990 (1964-11-01), Woods
patent: 3828758 (1974-08-01), Cary
patent: 4633847 (1987-01-01), Lossp et al.
patent: 4712535 (1987-12-01), Fujisawa

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