Apparatus for manufacturing semiconductor devices with a...

Semiconductor device manufacturing: process – Chemical etching – Having liquid and vapor etching steps

Reexamination Certificate

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C216S092000

Reexamination Certificate

active

06939807

ABSTRACT:
An apparatus for manufacturing semiconductor devices includes a supporter portion on which a semiconductor substrate is placed, a nozzle portion for injecting a fluid to an edge of the substrate placed on the supporter portion, a shielding cover for preventing the fluid injected from the nozzle portion from flowing to a shielding portion among a pattern-formed portion, and a shielding cover moving portion device for moving the shielding cover up and down. The apparatus makes it possible to prevent a chemical solution injected to the edge of a wafer from flowing to a shielding portion of the wafer when the wafer edge is etched.

REFERENCES:
patent: 6123865 (2000-09-01), Lin et al.
patent: 6733686 (2004-05-01), Hata
patent: 10-214023 (1989-08-01), None
patent: 07-020623 (1995-01-01), None
patent: 10-189421 (1998-07-01), None
patent: 10-199778 (1998-07-01), None
patent: 1999-18792 (1999-06-01), None

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