Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1974-03-08
1976-03-02
Shore, Ronald J.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
249 85, 249 93, B28B 2300, B22D 1900
Patent
active
039415325
ABSTRACT:
Disclosed is a method for fabricating semiconductor devices and apparatus that can be used in the practice thereof. A plurality of sets of lead wires is mounted in a reusable primary lead frame. While supporting the lead frame, and thus the lead wires, a pellet is attached to one wire of each of the sets and appropriate flying leads are bonded in place. The sets of lead wires are then transferred to a reusable segmented lead frame, that includes a plurality of elements which are resiliently mounted with respect to each other. Each element supports one set of lead wires. A plurality of cup-shaped mold cavities defined by the mold are filled with a curable fluid encapsulant. The mold is adapted to cooperate with the segmented lead frame as hereinafter set forth. The ends of the lead wires supporting the pellets are immersed in the encapsulant. Alignment pins on the segmented lead frame made with the alignment openings in the mold, thus insuring proper alignment of the sets of lead wires and the cup-shaped mold cavities.
REFERENCES:
patent: 1628434 (1927-05-01), Schnaier
patent: 1973117 (1934-09-01), Sklar
patent: 2276380 (1942-03-01), English
patent: 2418823 (1947-04-01), Desimone
patent: 3584106 (1971-06-01), Miller
Fennessy Donald W.
Schmitz Harry W.
Brown John S.
General Electric Company
Mooney R. J.
Shore Ronald J.
Stoner D. E.
LandOfFree
Apparatus for manufacturing semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus for manufacturing semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for manufacturing semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1275780